Process engineer
Full Time
full time
28 Oct 2025
Santa Clara
Verified by Turrior
Content + Source + Freshness • 18 Dec 2025 • 95% confidence
78 / 100
Offer value
High value characterized by robust salary potential, extensive role relevance in photonic technology, and significant integration with current industrial practices.
- Competitive salary indicating high industry value.
- Significant involvement in advanced photonic technologies.
- Opportunities to engage with interdisciplinary teams.
Pros
- Attractive salary demonstrating industry competitiveness.
- Hands-on role in pioneering photonic technologies.
- Ability to collaborate with cross-discipline teams for optimal design.
Cons
- Complex role may require adapting to challenging project demands.
- May involve extensive hours during critical project phases.
- Niche specialization requires highly focused skill sets.
Who it's for
Experienced / Specialized • On-site
Good fit
- Engineers with specialized degrees and experience.
- Individuals seeking impactful engineering roles.
- Professionals ready to innovate in photonics technology.
Not recommended for
- Newcomers without relevant experience.
- Candidates preferring low-pressure roles.
- Those averse to roles requiring intensive problem-solving.
Motivation fit
Desire to advance in cutting-edge technological fields.Interest in collaborative framework for innovative solutions.Eagerness to tackle complex engineering challenges.
Key skills
Packaging engineeringOptical design and simulationCross-disciplinary collaborationAnalytical problem-solving
Score: 78/100 AI verified analysis
About the job
Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration. Lead Cu backplane RDL design, layout, fabrication, and integration. Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements. Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance. Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance. Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability. Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered). Proven experience in Cu RDL layout, design, fabrication, and integration. Hands-on expertise in thermal compression bonding and hybrid bonding processes. Experience with Co-Packaged Optics (CPO) and Optical Engine development. Experience working in cleanroom environments and advanced IC fabrication. Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys. Strong problem-solving skills and ability to work in a collaborative research environment.
